Molybdenum target bonding is a process of attaching a molybdenum target onto a backing plate. This process involves using high temperature brazing techniques to bond the molybdenum target, which enables it to withstand the high thermal and mechanical stresses during sputtering processes. The high vacuum compatibility and excellent thermal conductivity of molybdenum targets make them highly suitable for use in plasma-based deposition techniques such as physical vapor deposition (PVD) and magnetron sputtering. Target bonding is a crucial step towards ensuring that molybdenum targets perform efficiently and reliably over their lifespan.
Molybdenum target bonding involves the process of joining a molybdenum target to a backing plate, creating a strong bond that can withstand the high-temperature and high-stress environments required for sputtering applications. The operating principle of molybdenum target bonding depends on the specific bonding method used.
One common bonding method is brazing, which involves heating a filler metal above its melting point but below the melting point of the base materials, allowing it to flow and join the materials together. This creates a strong, permanent bond that can withstand high temperatures and stresses.
Another bonding method is diffusion bonding, a solid-state welding process that uses heat and pressure to join the materials, allowing atoms to diffuse across the interface and form strong bonds.
Explosive bonding is a bonding method that creates a high-speed collision between two pieces of metal, causing them to bond together. This provides a strong bond that can withstand high temperatures and stresses.
The specific bonding method used depends on factors such as the size and shape of the target, the type of substrate, and the intended application. Overall, the operating principle of molybdenum target bonding involves creating a strong, permanent bond between the target and backing plate to withstand the harsh environments required in sputtering applications.
There are several methods for bonding molybdenum targets to backing plates, each with its own advantages and limitations. The method chosen will depend on factors such as the size and shape of the target, the type of substrate, and the intended application. Here are a few bonding methods used for molybdenum targets:
Brazing - This method involves bonding two materials by heating a filler metal above its melting point but below the melting point of the base materials, allowing it to flow and join the materials together. Brazing is a common method used for bonding molybdenum targets as it creates a strong, permanent bond that can withstand high temperatures and stresses.
Diffusion bonding - This is a solid-state welding process that uses heat and pressure to join the materials, allowing atoms to diffuse across the interface and form strong bonds. Diffusion bonding is preferred when high bonding strength is required without introducing contaminants or compromising material properties.
Explosive bonding - This method creates a high-speed collision between two pieces of metal, causing them to bond together. Explosive bonding provides strong bonding and can withstand high temperatures and stresses.
Other methods may be used, such as thermal compression bonding, direct bonding, and ultrasonic bonding. The bonding method chosen will depend on the specific requirements of the application.
